.80 mm Pitch BGA Sockets

PRODUCT DESCRIPTION:

Plastronics now offers .80 mm pitch test and burn-in sockets for fine pitch BGA and CSP packages. The dual pinch contact technology creates excellent contact with the small solder balls associated with CSP packages while maintaining no deformation on the lower 50% of the solder balls.

SPECIFICATIONS:

3 Body Sizes Available:

• Socket size 19.50 x 26.00 - up to 10 x 18 matrix
• Socket size 22.00 x 28.00 - up to 15 x 21 matrix
• Socket size 22.00 x 26.00 - up to 16 x 20 matrix

Solder Ball Size 0.45 +/- 0.05

• Call for information on additional sizes.

• 1.66 Kg (avg.)

• Mounting Method to Board: Thru-hole Mount
• Socket Operation: ZIF (Push cover 3 mm stroke)
• Operating Temperature: -65° C to +150° C
• Contact Force: 10+/- 3 gf
• Life Cycles: 20,000 Mechanical Cycles

PHYSICAL PROPERTIES:

• Plastic Body: PEI
• Plastic Grid Plates: PEI
• Contact Base Metal: BeCu
• Contact Plating: Au over Ni

ELECTRICAL PROPERTIES:

• Contact Resistance: < 50 mOhm
• Inductance: < 6 nH
• Capacitance: < 2.59 pF
• Current Rating: 1A
• Volume Resistivity: 1,000 MOhm @ 100 VDC
• Insulation Resistance: 100 VAC for 1 minute

PACKAGE PARAMETERS (mm) for .80mm Pitch